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Composite lightweight copper plated aluminum wire

Patent
US-6178623-B1
Inventor

KITAZAWA HIROSHI (JP)

YAMAGUCHI TATSUO (JP)

TSUKADA ETSURO (JP)

Assignee
TOTOKU ELECTRIC (US)
Country
United States
Dates
  • Priority:
    1997/12/16
  • Grant:
    2001/01/30
Description
This web page summarizes information in PubChem about patent US-6178623-B1. This includes chemicals mentioned, as reported by PubChem contributors, as well as other content, such as title, abstract, and International Patent Classification (IPC) codes. To read more about how this page was constructed, please visit the PubChem patents help page.

1 Abstract

A copper plated aluminum wire with improvement in adhesive properties is fabricated by a method which includes a displacement step of forming a thin layer of a metal by displacement on a surface of an aluminum or aluminum alloy conductor, an electroplating step of coating a surface of the thin layer continuously with copper layers by electroplating to have a copper coated aluminum conductor, and a thermal diffusion step of heat treating the copper coated aluminum conductor at a temperature of 120° C. to 600° C. under an inert gas atmosphere for thermal diffusion. A plated aluminum wire is provided having an anchor metal layer formed by displacement plating, a low thermally conductive metal layer formed by electroplating, and a high electrically conductive metal layer formed by electroplating in which all of the layers are sequentially deposited on an outer surface of an aluminum or aluminum alloy conductor. A plated aluminum wire is provided having an anchor metal layer formed by displacement plating and a high electrically conductive metal layer formed by electroplating in which both of the layers are sequentially deposited on an outer surface of an aluminum or aluminum alloy conductor. A composite lightweight copper plated wire is provided having an electrically conductive metal layer that is deposited by electroplating on an outer surface of an anchor metal layer provided on an aluminum conductor.

2 Full Text

3 Important Dates

3.1 Priority Date

1997/12/16

3.2 Filing Date

1998/10/01

3.3 Publication Date

2001/01/30

3.4 Grant Date

2001/01/30

4 Inventor

KITAZAWA HIROSHI (JP)

YAMAGUCHI TATSUO (JP)

TSUKADA ETSURO (JP)

5 Assignee

TOTOKU ELECTRIC (US)

6 Country

United States

7 Linked Chemicals

7.1 PubChem Compounds

7.2 PubChem Substances

8 Patent Family

9 Classification

9.1 IPC

C25D5/50 (inventive)

C25D5/10 (inventive)

C25D7/06 (inventive)

C25D5/44 (inventive)

9.2 CPC

C25D5/10 (inventive)

H01L2224/45574

H01L2924/01029

H01L2924/01047

H01L2224/431

H01L2224/45655

H01L2924/00014

H01L2924/01078

H01L2924/0103

H01L2224/45669

H01L2924/01079

H01L24/43 (inventive)

H01L2224/45644

H01L2224/45618

H01L2924/01012

H01L2224/43848

H01L2224/45573

H01L2224/45601

H01L2224/45639

H01L2224/45118

H01L2924/01014

C25D5/44 (inventive)

H01L2224/45015

H01L2224/43

H01L2224/45666

H01L2224/45124

H01L2224/45664

H01L2924/014

H01L24/45 (inventive, first)

H01L2924/0105

H01L2924/01006

H01L2924/01028

H01L2224/45671

H01L2224/45647

H01L2224/4566

H01L2924/01019

H01L2224/45624

H01L2924/01074

C25D5/50 (inventive)

Y10T29/49117

10 Citations

11 Cited By

12 Similar Patents

13 Information Sources

  1. Google Patents
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