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Thermosetting silicone resin molding composition

Patent
US-4144222-A
Inventor

SHINMI HIDEO

HANADA TSUNEO

Assignee
TORAY SILICONE CO
Country
United States
Dates
  • Priority:
    1976/09/07
  • Grant:
    1979/03/13
Description
This web page summarizes information in PubChem about patent US-4144222-A. This includes chemicals mentioned, as reported by PubChem contributors, as well as other content, such as title, abstract, and International Patent Classification (IPC) codes. To read more about how this page was constructed, please visit the PubChem patents help page.

1 Abstract

An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.

2 Full Text

3 Important Dates

3.1 Priority Date

1976/09/07

3.2 Filing Date

1977/07/28

3.3 Publication Date

1979/03/13

3.4 Grant Date

1979/03/13

4 Inventor

SHINMI HIDEO

HANADA TSUNEO

5 Assignee

TORAY SILICONE CO

6 Country

United States

7 Linked Chemicals

7.1 PubChem Compounds

7.2 PubChem Substances

8 Patent Family

9 Classification

9.1 IPC

C08L83/00 (inventive, first)

C08L83/04 (inventive)

9.2 CPC

C08K5/57 (inventive, first)

C08K3/011 (inventive)

C08G77/12

C08G77/70

C08G77/16

10 Citations

11 Cited By

12 Similar Patents

13 Information Sources

  1. Google Patents
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  2. PubChem
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