Process of assembling semiconductor device
Patent
US-10750621-B2
Inventor
INOUE SHINGO (JP)
Assignee
SEDI INC (JP)
Country
United States
Dates
- Priority:2017/08/02
- Grant:2020/08/18
Description
This web page summarizes information in PubChem about patent US-10750621-B2. This includes chemicals mentioned, as reported by PubChem contributors, as well as other content, such as title, abstract, and International Patent Classification (IPC) codes. To read more about how this page was constructed, please visit the PubChem patents help page.
A process of assembling a semiconductor device is disclosed. The process includes steps of arraying metal bases on a carrier; applying sintered metal paste simultaneously onto the bases; disposing a substrate simultaneously onto the sintered metal paste where the substrate includes side walls corresponding to the bases and a wiring layer common the bases; and volatilizing solvent contained in the sintered metal paste.
2017/08/02
2018/08/01
2020/08/18
2020/08/18
INOUE SHINGO (JP)
SEDI INC (JP)
United States
H01L25/00 (inventive)
H05K3/34 (inventive)
H01L21/50 (inventive, first)
H01L23/00 (inventive)
H01L23/3736
H01L23/145
H01L23/13
H01L23/047 (inventive)
H01L21/50 (inventive, first)
H01L24/83 (inventive)
H01L25/50 (inventive)
H01L24/27 (inventive)
H05K3/3421 (inventive, first)
H01L2224/2732
H01L2924/17788
H01L2224/83855
- US-4323719-A (SEA)
- JP-H11307664-A (APP)
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- US-2010093131-A1 (SEA)
- JP-2011165931-A (APP)
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- International Search Report for PCT/JP2018/028924 dated Oct. 16, 2018. (APP,APP)
- Written Opinion (International Searching Authority) for PCT/JP2018/028924 dated Oct. 16, 2018. (APP,APP)
- US-2021351263-A1 (SEA)
- US-11957015-B2 (SEA)
- Google PatentsLICENSE"Google Patents Research Data" by Google, based on data provided by IFI CLAIMS Patent Services and OntoChem, is licensed under a Creative Commons Attribution 4.0 International License.https://creativecommons.org/licenses/by/4.0/legalcode
- PubChem
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