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Method of preparing reactive urea formaldehyde resin-based adhesives

Patent
EP-0366879-B1
Country
European Patent Office
Dates
  • Priority:
    1988/10/21
  • Grant:
    1992/09/23
Description
This web page summarizes information in PubChem about patent EP-0366879-B1. This includes chemicals mentioned, as reported by PubChem contributors, as well as other content, such as title, abstract, and International Patent Classification (IPC) codes. To read more about how this page was constructed, please visit the PubChem patents help page.

1 Abstract

The invention relates to the preparation of urea-formaldehyde resin adhesives which are suitable for the production of chipboard meeting formaldehyde emission Class E 1 and which have high reactivity. The adhesive is prepared by reacting urea with formaldehyde with a molar ratio of 1:1.8 to 1:2.1 under weakly alkaline conditions at 288 to 313 K, until from 10 to 15% of the total formaldehyde is bonded as methylol groups. Further condensation of the product at pH values of from 5.0 to 5.5 at 300 to 323 K and residence times of from 15 to 25 minutes, after which, before acidic condensation, first in an alkali medium at 288 to 313 K, from 10 to 15% of the total formaldehyde is bound in the form of methylol groups.

2 Full Text

3 Important Dates

3.1 Priority Date

1988/10/21

3.2 Filing Date

1989/07/29

3.3 Publication Date

1992/09/23

3.4 Grant Date

1992/09/23

4 Country

European Patent Office

5 Linked Chemicals

5.1 PubChem Compounds

5.2 PubChem Substances

6 Patent Family

7 Classification

7.1 IPC

B27N3/00 (inventive)

C08G12/12 (inventive)

C08L97/02 (inventive)

C09J161/24 (inventive)

7.2 CPC

C08L2666/26

C08G12/12 (inventive)

C08L97/02 (inventive, first)

C09J161/24 (inventive)

8 Similar Patents

9 Information Sources

  1. Google Patents
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  2. PubChem
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