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Systems and methods for workpiece processing using neutral atom beams

Patent
US-11251075-B2
Inventor
SAVAS STEPHEN E (US)
Assignee

MATTSON TECH INC (US)

BEIJING E TOWN SEMICONDUCTOR TECH CO LTD (CN)

Country
United States
Dates
  • Priority:
    2018/08/06
  • Grant:
    2022/02/15
Description
This web page summarizes information in PubChem about patent US-11251075-B2. This includes chemicals mentioned, as reported by PubChem contributors, as well as other content, such as title, abstract, and International Patent Classification (IPC) codes. To read more about how this page was constructed, please visit the PubChem patents help page.

1 Abstract

Plasma processing systems and methods are provided. In one example, a system includes a processing chamber having a workpiece support. The workpiece is configured to support a workpiece. The system includes a plasma source configured to induce a plasma from a process gas in a plasma chamber to generate one or more species of negative ions. The system includes a grid structure configured to accelerate the one or more negative ions towards the workpiece. The grid structure can include a first grid plate, a second grid plate, and one or more magnetic elements positioned between the first grid plate and second grid plate to reduce electrons accelerated through the first grid plate. The system can include a neutralizer cell disposed downstream of the grid structure configured to detach extra electrons from ions of the one or more species of negative ions to generate energetic neutral species for processing the workpiece.

2 Full Text

3 Important Dates

3.1 Priority Date

2018/08/06

3.2 Filing Date

2018/08/06

3.3 Publication Date

2022/02/15

3.4 Grant Date

2022/02/15

4 Inventor

SAVAS STEPHEN E (US)

5 Assignee

MATTSON TECH INC (US)

BEIJING E TOWN SEMICONDUCTOR TECH CO LTD (CN)

6 Country

United States

7 Patent Family

8 Classification

8.1 IPC

H01J37/305 (inventive)

H01J37/32 (inventive)

H01J27/14 (inventive)

H01L21/768 (inventive)

H01L21/26 (inventive, first)

8.2 CPC

H01J37/32422 (inventive, first)

H01J27/024 (inventive)

H01L21/76826 (inventive, first)

H01J37/3266 (inventive)

H01J37/3053 (inventive)

H01J2237/0041

H05H3/02

H01J27/14 (inventive)

H01J37/08 (inventive, first)

H01J37/32669 (inventive)

9 Citations

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10 Cited By

11 Similar Patents

12 Information Sources

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